https://www.hjkir.com/industry/en 红外热成像专家 Thu, 20 Jan 2022 09:07:56 +0000 en-US hourly 1 https://wordpress.org/?v=6.5.5 https://www.hjkir.com/industry/wp-content/uploads/2021/03/cropped-未标题-3-32x32.png https://www.hjkir.com/industry/en 32 32 https://www.hjkir.com/industry/en/1538.html Thu, 08 Apr 2021 03:16:45 +0000 https://www.hjkir.com/?p=1538 Technical Parameters Of Ultrasonic Vibration Testing Plate

Main Chip Configuration
FPGA	XC7Z015
DDR	1GB(512MByte × 2)
FLASH	32MByte QSPI  FLASH
Electrical Characteristics
Power Interface	KF2EDGR-3.81-2PW
Input Power Supply Voltage	8～15VDC
ADC	12bit/14bit @max 5Msps  × 4
Ultrasonic Vibration Sensor Interface	SMA-KE × 4
SFP Interface	SFPCAGE005-L  × 2
SD Card Interface	473521001
Steady State Power Consumption	<1.5W
Environmental Parameters
Operation Temperature	-40℃～60℃
Storage Temperature	-45℃～70℃
Resistance To Temperature Shock	5℃/min（-40℃～60℃）
Vibration Resistance	4.3g, 2 hours for each axis of x, y and z axes
Shock Resistance	Acceleration 30g, Half Sine Wave, Pulse Width 6ms, Impact 3 Times In The Direction Of Installation And Use
Humidity	≤ 95% (non condensing)
Physical Characteristics
Overall Dimension	130mm×96mm×23mm
Weight	<127g

 

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