红外板卡 – 华景康光电科技官网 https://www.hjkir.com/industry/en 红外热成像专家 Thu, 19 May 2022 03:16:19 +0000 en-US hourly 1 https://wordpress.org/?v=6.5.5 https://www.hjkir.com/industry/wp-content/uploads/2021/03/cropped-未标题-3-32x32.png 红外板卡 – 华景康光电科技官网 https://www.hjkir.com/industry/en 32 32 RK3288 双光融合板 https://www.hjkir.com/industry/en/2904.html Thu, 06 Jan 2022 06:29:12 +0000 https://www.hjkir.com/index2.php/?p=2904 Technical Parameters Of RK3288 Dual Optical Fusion Board
Main Chip Configuration
ARM RK3288
DDR 2GB (4*512MB)
eMMC 16GB
Electrical Characteristics
Power Interface 796638-2
Input Power Supply Voltage 12VDC
SD Card Interface TF-01A
Key Interface BM06B-GHS-TBT(TTL3.3V)
Reserved GPIO BM06B-GHS-TBT(TTL3.3V)
HDMI Interface Fused Video Output
Gigabit Network Interface Support Infrared Camera And Visible Camera Video Input Through The Switch
Microusb Interface Support USB-OTG
USB-A Interface Support USB-Host
Steady State Power Consumption Two Cameras Are Connected At The Same Time, <6w
Environmental Parameters
Operation Temperature -40℃～60℃
Storage Temperature -45℃～70℃
Resistance To Temperature Shock 5℃/min（-40℃～60℃）
Vibration Resistance 4.3g, 2 hours for each axis of x, y and z axes
Shock Resistance Acceleration 30g, Half Sine Wave, Pulse Width 6ms, Impact 3 Times In The Direction Of Installation And Use
Humidity ≤ 95% (non condensing)
Physical Characteristics
Overall Dimension 140mm×70mm×15mm，Plate thickness1.6mm
Weight 70g

 

]]> 多功能手持机方案板卡 https://www.hjkir.com/industry/en/1543.html Thu, 08 Apr 2021 03:20:01 +0000 https://www.hjkir.com/?p=1543 Technical Parameters Of Laser Illuminating Plate
Main Chip Configuration
FPGA XC7Z015
DDR 1GB(512MByte × 2)
FLASH 32MByte QSPI  FLASH
Image Processing And Display
Analog Video Output CVBS (PAL)
Digital Video Output 1920×1080@OLED × 2
Electronic Magnification 1x/2x/4x
Optical Zoom White Light Camera Support
Palette Infrared Camera Supports Four Color Palettes, Including White Hot, Black Hot, Iron Red And Rainbow
Contrast And Brightness Manual
Focus Mode Electric
Electrical Characteristics
Power Interface 796638-2
Input Power Supply Voltage 12～40VDC
White Light Camera Interface 1 541324062 (BT1120 + UART@TTL3.3V)
White Light Camera Interface 2 BM15B-GHS-TBT（Motor control）
White Light Camera Interface 3 FPC1.25MM-2P(filter control)
Infrared Camera Interface BM14B-GHS-TBT(BT656 + UART@TTL3.3V)
Oled Display Interface 503566-4500  × 2
Magnetic Compass Interface BM04B-GHS-TBT(UART@TTL3.3V)
Beidou Interface BM06B-GHS-TBT(UART@TTL3.3V)
Laser Interface BM06B-GHS-TBT(UART@TTL3.3V)
Analog Video Interface BM06B-SRSS-TB
Control Key Interface       BM04B-GHS-TBT × 2
Switch Button Interface BM02B-GHS-TBT
Proximity Switch Interface BM03B-GHS-TBT
Synchronization Module Interface BM11B-GHS-TBT
Ethernet Interface BM11B-GHS-TBT
SD Card Interface 500901-0801
Steady State Power Consumption <1.8W
Environmental Parameters
Operation Temperature -40℃～60℃
Storage Temperature -45℃～70℃
Resistance To Temperature Shock 5℃/min(-40℃～60℃)
Humidity ≤ 95% (non condensing)
Vibration Resistance 4.3g, 2 hours for each axis of x, y and z axes
Shock Resistance Acceleration 30g, Half Sine Wave, Pulse Width 6ms, Impact 3 Times In The Direction Of Installation And Use
Physical Characteristics
Overall Dimension 125mm×65mm×10mm
Weight <62g

 

]]> 超声振动检测板 https://www.hjkir.com/industry/en/1538.html Thu, 08 Apr 2021 03:16:45 +0000 https://www.hjkir.com/?p=1538 Technical Parameters Of Ultrasonic Vibration Testing Plate
Main Chip Configuration
FPGA XC7Z015
DDR 1GB(512MByte × 2)
FLASH 32MByte QSPI  FLASH
Electrical Characteristics
Power Interface KF2EDGR-3.81-2PW
Input Power Supply Voltage 8～15VDC
ADC 12bit/14bit @max 5Msps  × 4
Ultrasonic Vibration Sensor Interface SMA-KE × 4
SFP Interface SFPCAGE005-L  × 2
SD Card Interface 473521001
Steady State Power Consumption <1.5W
Environmental Parameters
Operation Temperature -40℃～60℃
Storage Temperature -45℃～70℃
Resistance To Temperature Shock 5℃/min（-40℃～60℃）
Vibration Resistance 4.3g, 2 hours for each axis of x, y and z axes
Shock Resistance Acceleration 30g, Half Sine Wave, Pulse Width 6ms, Impact 3 Times In The Direction Of Installation And Use
Humidity ≤ 95% (non condensing)
Physical Characteristics
Overall Dimension 130mm×96mm×23mm
Weight <127g

 

]]> Cameralink 转接板 https://www.hjkir.com/industry/en/1533.html Thu, 08 Apr 2021 03:12:49 +0000 https://www.hjkir.com/?p=1533 Technical Parameters Of Cameralink Adapter Board
Main Chip Configuration
FPGA 6SLX45CSG324
DDR 512MByte
FLASH 32MByte
Image Processing And Display
Analog Video Output CVBS(PAL)
Analog Video Electronic Zoom 1x/2x/4x
Digital Video Output 1920×1080@Cameralink
Contrast And Brightness Manual
Center Crosshairs Support
Electrical Characteristics
Digital Electrical Interface J30JZPN21ZKNA000
Analog Video Interface BM06B-SRSS-TB
Input Power Supply Voltage DC5～12V
Steady State Power Consumption <1.0W
Communication Interface UART@RS422
Environmental Parameters
Operation Temperature -40℃～60℃
Storage Temperature  -45℃～70℃
Resistance To Temperature Shock 5℃/min(-40℃～60℃)
Vibration Resistance 4.3g, 2 hours for each axis of x, y and z axes
Shock Resistance Acceleration 30g, Half Sine Wave, Pulse Width 6ms, Impact 3 Times In The Direction Of Installation And Use
Humidity ≤ 95% (non condensing)
Physical Characteristics
Overall Dimension 38mm×38mm×11mm
Weight <10g

 

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